India has marked a major milestone in its semiconductor journey as Kaynes Semicon rolled out the country’s first commercially packaged multi-chip module (MCM) from its OSAT (Outsourced Semiconductor Assembly and Test) facility in Sanand, Gujarat.
The initial shipment comprises 900 intelligent power modules (IPMs), which have been sent to Alpha & Omega Semiconductor (AOS) in the United States. The Sanand facility was developed under India’s Semiconductor Mission with substantial central investment.
These IPMs are complex components, integrating multiple dies such as IGBTs, controllers, diodes and other elements into a single high-performance module suited for applications in automotive, industrial, and clean energy systems. The successful delivery signals India’s growing capabilities in advanced chip packaging and its emergence as a node in the global semiconductor supply chain.
Authorities and industry players expect this achievement to spur further investment, accelerate domestic technology development, and enhance India’s position in global electronics manufacturing.
